Well, I put one in last night. Without the thermal pad, there
was too much gap between the top of the chip and the fan/heatsink
assembly for good contact, so I left the thermal pad in. Seems
to work fine, so far. The case below the processor does feel a
little hotter now, but still not as hot as the old 770 I had.
Illmatik 1 wrote:
>
> Hi all,
>
> I've recently received my T20 from IBM w/ new screen, i/o card
and system board. I've got a 1ghz chip I've just put in. I've
decided to remove the thermal pad and use Shin-Etsu
g751(overclocker's special) thermal compound instead. Would you
guys agree with this procedue?
>
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Received on Fri May 2 10:42:40 2003
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